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FANUC Brings AI Robotics to PACK EXPO 2026
On October 6, 2026, FANUC America announced it will showcase how artificial intelligence, collaborative robotics, and machine vision are automating packaging and processing at PACK EXPO International 2026 (October 18–21, Chicago). The headline demonstration is a collaborative robot that runs on natural-language commands—an attendee speaks a production request, and generative...